Job Description:

Typically requires BSEE or relevant educational qualification with 12+ years of PCB industry related experience and requires 8+ years direct PCB design experience.

The position is responsible for the complete end to end design of high-speed, highly constrained, and double side surface mount PCB (printed circuit board) using Cadence Allegro and design verification tools (DFM/DFA). The designer is requested to work closely with hardware engineers for the development of such power; thermal; mechanical; EMC; safety; ICT and manufacturing. The designer is responsible to insure that all of hardware design, fab and assembly are met to Cisco’s standard. The experience of the multiple project management and global team work is expected. As senior CAD designer, the role of mentoring junior designers is also required.

Skill requirements:

1.         Excellent technical leadership qualities.

2.         Extensive experience in PCB design including placement, routing and fab/assembly/post process documentation.

3.         Knowledge of PCB construction and experience in PCB design utilizing surface mount, high-density double-sided technologies and the latest fabrication technologies such as HDI, micro-via and alternative board materials.

4.         Successful candidate will be familiar with EMI compliance considerations, high-speed signal integrity challenges, critical net routing, thermal and mechanical issues as well as design for high volume manufacturability and test.

5.         Experience with micro (0.8mm) BGA and micro-via/HDI technology a plus. Excellent CAD skills and proven track record of successful designs and experience leading a senior ECAD team is required.

6.         Extensive expertise with either Cadence or Mentor design tools, including either Specctra or Destination autorouters is required. 

7.         Experience with Valor and/or Adiva DFM/DFA tools is also preferred. 

8.         Expertise developing utilities, scripts and web pages using Perl, Java, Cadence Skill, etc., is highly desirable

9.         Strong communication skills, both written and verbal, are essential.

10.     Experience working autonomously with remote management or team members and familiarity with distributed product development support and collaboration is a must.

11.     Rich independent working experience of high speed signal routing and integrity challenges, general EMC and high volume FAB design is required. The strong knowledge of HDI design, PCB fab process and advanced technologies is also requested.

12.     5 year Experience of project management and process including project initiative, global cross function, project plan, status update, etc is expected.

13.     Fluent English and global communication skill are required.