半导体封装设备机械工程设计师/Team Project Leader

汇报对象: Line Manager

工作地点: 上海张江

公司介绍: 该公司来自美国, 是一个研发,设计,生产,销售最先进的半导体芯片制造过程设备的公司. 其在上海投资的公司将研发,设计最先进的芯片级封装的生产设备．以达到更有效率，更有伸缩性及更有环保性．

 

职位要求:

从事自动化设备的机械设计和制造有5年以上的经历,其中在半导体设备的设计和制造要有3年以上。

 

熟悉电气和气动的机械系统设计。熟悉真空设备的设计观念. 了解半导体封装设备的洁净无尘的设计观念和全自动化设计观念.

 

具有丰富的半导体设备零件元件的知识.对以下零件元件足够的知识和观念,能从供应商的产品目录中,精准地选择设计中所需要的: 温度控制器, 温度传感器, 气动阀门/气缸, 氧气分析仪, 空压机, MFC, 流量测量器, 各类传感器, 真空机, 真空测量器, 真空系统用到的运动器件等等.

 

熟练使用Autocad、Solidworks和编制工艺文件。能完成机械设计的3D,2D图, 气动回路流程图, 编制BOM文件和生成及管理所设计的半导体设备的所有文件. 能提供软件电脑工程师机械操作的方式. 能提供电气工程师所有选用的元件的电路要求及电源的配制.

 

能独立完成相关的项目。善于管理一个有机械厂工程师和电气工程师的团队以完成一个半导体封装设备的设计工程并有能力管理该产品的Product Life Cycle.

 

良好的英语阅读和语言交流能力。

 

具有机械设计本科或硕士以上学位.

 

               

 

 

 

 

 

 

 

 

 

Semiconductor Packaging Equipment Mechanical Design Engineer/Project Team Leader

 

At least 5 years of mechanical design experience in the sophisticated automation equipment area, and at least 3 out of the 5 years of such mechanical design experience should be in the Semiconductor Equipment area.

 

Familiar with the design concepts of electrical and pneumatic mechanical system. Familiar with vacuum system design. Familiar with the concept of the Clean Room requirements of semiconductor equipment. Familiar with semiconductor packaging equipment design concepts in solder bumping automation and process.

 

Detailed knowledge of the common components and parts used in semiconductor equipment, such as: temperature controller, thermal couple, pneumatic valves and cylinders, O2 analyzer, air compressor, MFC, flow meter, sensors, vacuum pump, vacuum indicator, and motion parts for vacuum system. Capable of selecting the exactly-working components/parts by researching and investigating vendor’s components/parts catalog.

 

Proficient with Autocad, Solidworks software design packages. Capable of producing the required 3D and 2D drawings, system pneumatic flow diagram, BOM list and assigning part number. Capable of producing and managing required documentation of the semiconductor packaging equipment being designed.

 

Capable of instructing an Electrical Engineer to complete the electrical power distribution system and wiring of the system being designed. Capable of instruction software engineer to complete the automation system programming of the system being designed.

 

Capable of working independently as well as working as a team leader to finish a Semiconductor Packaging Equipment project. Capable of managing a team of mechanical and Electrical engineers to finish a design project. Capable of managing product life-cycle of a semiconductor packaging equipment.

 

Proficient in speaking and reading/writing English.

 

With Mechanical Engineering BS, MS or Ph.D. degree.