Main Responsibility Areas

1. Both SMT & FAP(final assembly & packing) sub process ownership in factory. eg, master the BU requirements and future technology trend of screwing or customising process.
2.Contact interface between factory and equipment/tools supplier, other Nokia factories
3.Master the screwing, customising standard that corresponding to individual product. Be sure to the standard being implemented in production line.
4. Automation system analysis & study, supplier engineering contact window for FAP automation system;
5.Support special design /optimize requriments for equipment team. Other new technology application in SMT/FA area.

Requirements:

o Preferably come with electro-mechanical background with at least 3 years of experience in industry engineering designing for manufacturing usage
o Strong technical expertise in one or more of the following:
- Knowledge in DFM & DFFA
- Assembly tooling and skill capability
- Failure analysis at FAP
- Knowledge of CAD/CAM or similar computer tools
- PLC or similar numerical control application skills
o Good communication skill and strong manufacturing process design capabilities
o Good knowledge in process design and strong discipline in process flow adherence
o Knowledge in 6-sigma and / or lean manufacturing is desired
o Some knowledge in Industrial Engineering is an advantage
o Experience in dealing with suppliers/vendors will be an added advantage
o Good communication skill with good report writing as well as good analytical skill
o Hands-on with full understanding of working instruction generation
o must possess not less than 5 years of related experience
o working in an fast-pace electronic industry is preferred
o hands-on attitude; can-do manner
o knowledge in QCC / 6-Sigma and or Lean Mfg is an added advantage ( those with Green / Black belt certification will be given priority )