Position can be based either in: Shanghai, Beijing, Hsinchu

Job Description:

Responsible for chip implementation of technical solutions to customer problems as part of a project team.

The candidates should have good design experiences in the digital implementation domain, Floorplan, P&R, STA, Physical verification.

The candidates should interact regularly with customers to identify and eliminate barriers to project success. Plans and manages delivery of own project-related tasks. Works with Project Lead to develop technical proposals, learning project life cycle. Produces consistently high quality technical solutions. The candidates need ability to work on multi person projects of varying complexity, working especially in a multi-site/multi-cultural project.

Essential Qualifications:

 Must have BS degree with 5+ years of applicable experience, MS degree with 3+ years of applicable experience in electrical engineering, microelectronics, comparable engineering science or solid state physics. Essential that the individual demonstrates strong communication, verbal and written. Requires good communication skills in English.

Desirable Qualifications:

 A minimum of four years relevant experience in industry. Good knowledge of semiconductor technologies, physical implementation of IC's. Good experience & knowledge in back-end/physical verification tools of at least one of the major EDA suppliers (Synopsys, Mentor, preferably Cadence). Experience in DSM Netlist to GDS implementation. - Will have demonstrated successful completion of 5+ physical design projects through to tape (at least one at 130nm or below) as an individual contributor. - Is able to work on-site at customer premises, travel up to 30%, and put in long hours when required to meet customer deadlines.